SINTAIKE STK-7200V全自动晶圆切割贴膜机(真空)
  • 概述
  • 参数
  • 应用范围
  • 资料
  • 相关产品
  • 品牌
  • 视频

    全自动晶圆切膜机(真空)STK-7200V特点:


    无滚轮的特殊真空安装技术(滚轮安装可选)

    配置进口多轴晶圆搬运机械手臂

    可以应对更薄的晶圆进行切割膜的贴膜

    晶圆位置和翘曲智能反馈

    17英寸触摸屏液晶工业电脑控制

    贴膜动作:全自动拉膜和贴膜,收废膜




    如需详细参数 欢迎您联系我们

    STK-7200V Fully Automatic Wafer Vacuum Mounter Specifications  


    Wafer Size

    Diameter:4”, 5”, 6” & 8”

    Wafer Thickness

    80 ~ 750 um

    Wafer material

    Si, SiC

    Wafer Type

    Single Flat, Double Flat or V-Notch

    Tape Type

    Blue Tape or UV Tape

    Width :230、300 mm, Length:100 m; Thickness: 0.05 ~ 0.2 mm

    Frame Type

    6” DISCO or K&S, 8” DISCO or K&S; or Customer Specified

    Mounting Theory

    Vacuum Mounting

    Wafer Place Accuracy

    X-Y: +/- 0. 1 mm    Θ: +/- 0.1°

    Input & Output

    Dual Input Wafer Cassette / Single Output Frame Cassette

    ESD Control

    ESD Roller / ESD Wafer Chuck / ESD Ion Blower

    Wafer Transfer

    Horizontal Multi Axis Robot with Vacuum or Bernoulli Endeffector

    Wafer Position & Warpage Intelligent Mapping in Cassette

    Wafer Alignment

    Fiber Sensor for Wafer Alignment

    Control Unit

    Standard Industrial PC with 17” Touch Panel LCD / Windows O/S

    Power Supplier

    Single Phase AC 220 V, 25A

    Air Supplier

    5.0 Kgf/cm2 CDA, 150 L/min

    Machine Construction

    Made of Full Aluminium Profile

    Dimensions

    1750 mm (W) × 1350 mm (D) × 1800 mm (H)

    Net Weight

    870 Kg



关注衡鹏:

qrcode_for_gh_229534a5836f_860.jpg