SINTAIKE STK-7200R全自动晶圆切割贴膜机(滚轮)
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    STK-7200R_SINTAIKE全自动晶圆切割贴膜机(滚轮)特点:


    全自动晶圆/框架装卸

    日本进口晶圆搬运机械手臂,晶圆对位系统

    全自动晶圆贴膜

    标置ESD特氟龙电镀接触晶片夹盘

    应对DBG工艺:贴膜后再撕BG膜

    贴膜动作:自动拉膜和贴膜

    晶圆台盘:通用(一体式)特氟龙防静电涂层接触式台盘;或硅胶台盘,或陶瓷台盘






    如需详细参数 欢迎您联系我们

    STK-7200R Fully Automatic Wafer Roller Mounter Specifications  


    Wafer Size

    Diameter: 6” 、8

    Wafer Thickness

    150 ~ 725 um

    Wafer material

    Si, SiC

    Wafer Type

    Single Flat, Double Flat or V-Notch

    Tape Type

    Blue Tape or UV Tape

    Width :230、300 mm, Length:100 m; Thickness: 0.05 ~ 0.2 mm

    Frame Type

    6” DISCO or K&S, 8” DISCO or K&S; or Customer Specified

    Mounting Theory

    Roller Mounting

    Wafer Place Accuracy

    X-Y: +/- 0. 1 mm    Θ: +/- 0.1°

    Input & Output

    Dual Input Wafer Cassette / Single Output Frame Cassette

    ESD Control

    ESD Roller / ESD Wafer Chuck / ESD Ion Blower

    Wafer Transfer

    Horizontal Multi Axis Robot with Vacuum or Bernoulli Endeffector

    Wafer Position & Warpage Intelligent Mapping in Cassette

    Wafer Alignment

    Fiber Sensor for Wafer Alignment

    Control Unit

    Standard Industrial PC with 17” Touch Panel LCD / Windows O/S

    Power Supplier

    Single Phase AC 220 V, 25A

    Air Supplier

    5.0 Kgf/cm2 CDA, 150 L/min

    Machine Construction

    Made of Full Aluminium Profile

    Dimensions

    1750 mm (W) × 1350 mm (D) × 1800 mm (H)

    Net Weight

    870 Kg


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