Fully automatic tape feeding & mounting

JEL Robot

Wafer position intelligent mapping

JEL Alignment

ESD Teflon plating chuck to handle various wafer 

Wafer cassette & FOUP / FOSB loading & Unloading

Automatic wafer edge profile cutting

Standard industrial PC control with 17” touch panel LCD

Full SST cover & door with aluminum profile frame

Built-in Ionizers for ESD protection

Non-UV & UV tape capability 

Standard configure dual load port

Power Supplier

Single Phase AC 220 V, 25A

Air Supplier

60 PSI CDA, 2.5 CFM

UPH

>= 45 PCs Wafer 

Conversion Time

Changeover between wafer size:  <= 30 Minutes

Machine Construction

Made of Full Aluminum Profile

Machine Cover

White plastic plating cover

Dimensions

1550 mm (W) × 1800 mm (D) × 1800 mm (H)

Net Weight

800Kg around 

Wafer Type

Si, GaAs Single Flat or V-Notch

Tape Type

Blue Tape or UV Tape

Width: 240 ~ 340 mm

Length:100m

Thickness: 0.05 ~ 0.2 mm

Taping Chuck Temp.

Room Temp. ~ 100 °C Controllable (Optional)

Cutting System

Multi-Axis Profile Cutter to Handling Various Wafer

Cutter Blade Temp.

Room Temp. ~ 120 ℃ Controllable

Wafer Place Accuracy

X-Y: +/- 0.2 mm, Θ : +/- 0.2°

Input & Output

Single Input Wafer Cassette / FOUP

Single Output Wafer Cassette / FOUP

EHS

Ergonomics: SEMI S8-95

Safety

SEMI S2-2000 / CE Standard Certifications:(Optional)

MHS

Wafer Cassette Load Port (E15.1)

FIMS (E62) & BOLTS (E63)

PGV Docking Zone (E64)

Kinematic Coupling (E57)

Communications

Optional SECS / GEM

ESD Control

Teflon Plating Wafer Chuck / Tape Transfer Rollers/ESD Blower

Wafer Robot

JEL Alignment