Wafer Size | Diameter:4”, 6” & 8” Thickness:300 ~ 725 um |
Wafer Type | Si , GaAsSingle Flat, Double Flat or V-Notch |
Tape Type | Blue Tape or UV Tape Width:120 ~ 240 mm Length:100m Thickness:0.03 ~ 0.2 mm |
Taping Chuck Temp. | Room Temp. ~ 100 °C Controllable (Optional) |
Cutting System | Multi-Axis Fine Precision Profile Cutter; edge cutter heater, up to 120℃ |
Wafer Place Accuracy | X-Y: +/- 0.2 mm Θ : +/- 0.2° |
Input & Output | Single Input Wafer Cassette / Single Output Wafer Cassette Customer Specified (Sample Supply) |
ESD Control | Ion Blower |
Wafer Robot | JEL Wafer Robot Wafer Position & Warpage Intelligent Mapping in Cassette |
Wafer Alignment | JEL Alignment |
Control Unit | Standard Industrial PC with 17” Touch Panel LCD,Windows7/10 ProO/S |
Power Supplier | ingle Phase AC 220 V, 20A |
Air Supplier | 60 PSI CDA, 2.5 CFM |
Conversion Time | <= 15 Minutes |
Dimensions | 1300 mm (W) ×1500mm(D) ×1800mm(H) |
Machine Construction | Made of Full Aluminium Profile |
Net Weight | 600 Kg around (Specifications items update without notice) |
