Unique Wx3 wafer handling system streamlines wafer flow for greater productivity |
Continuous digital magnification vision System provides optimal magnification for any eye-point |
Special agorithm predicts blade wear rates to reduce height measurement time and increase UPH |
Touch panel display supports a user-friendly graphical interface (GUI) |
Atomized wafer cleaning technology for superior process results |
Dedicated dressing cassette enables automatic blade dressing |
Built-in Inspection tray allows for in-process quality assessment |
Unique multi-panel processing capabilities |
Small footprint |
Optional: Dressing Station for diamonds exposure and clogging prevention |