ADT 7220シリーズダイシング ソウ
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    7220シリーズ ダイシング ソウ概要&特長:

    The 7200 Series is offered in three configurations optimized for IC applications, package singulation or hard material applications.

    Step into the Future of Dicing

    With new architecture and advanced process control tools, the 7200 models deliver substantially higher productivity compared to existing dicing systems, while minimizing the cost of operation. The system offers a wide range of advanced automation and process monitoring options to meet the requirements of your most challenging dicing applications:   


    Glass on Silicon


    GaAs wafers

    Package Singulation (BGA & QFN)



    Hard Materials

    7220シリーズ ダイシング ソウ利点

    Unique Wx3 wafer handling system streamlines wafer flow for greater productivity

    Continuous digital magnification vision System provides optimal magnification for any eye-point

    Special agorithm predicts blade wear rates to reduce height measurement time and increase UPH

    Touch panel display supports a user-friendly graphical interface (GUI)

    Atomized wafer cleaning technology for superior process results

    Dedicated dressing cassette enables automatic blade dressing

    Built-in Inspection tray allows for in-process quality assessment

    Unique multi-panel processing capabilities

    Small footprint

    Optional: Dressing Station for diamonds exposure and clogging prevention


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