SINTAIKE Wafer BonderFully Automatic Wafer Temporary Bonder
  • 概述
  • 参数
  • 应用范围
  • 资料
  • 相关产品
  • 品牌
  • 视频

    Fully Automatic Wafer Temporary Bonder:


    4"-8"/ 8"-12"wafer application.

    Automatic support wafer &device wafer bonding

    Thinner wafer capability

    Opitonal post measuring bonded wafer

    Vacuum thermal press bonding

    Compatible wafer cassette / wafer box

    PC based control with Windows OS

    Intelligent wafer mapping in cassette

    SECS/GEM or simple link capability

    Automatic support wafer & device wafer aligning



关注衡鹏:

著作権©1999-2017上海衡鵬企業ICP番号11051220 govicon.png沪公网安备 31010502002237号http://www.hapoin.com全権6361965666700518682694613.png