HANDLING | PERFORMANCE |
Cassette Size | Min 5 Inches, Max 8 Inches | Magnification | 2.5X/5X/10X |
Wafer Ring Size | Min 5 Inches, Max 8 Inches | Accuracy | 2.2/1.1/0.55um |
Onload/Offload | 1 | Repeatability | 4.4/2.2/1.1um |
Cassette Capacity |
| Min Defect Size | 15/8/5um |
Wafer Ring Transfer | Gripper | Throughput | 16/8/4WPH |
Reject Handling | e-Mapping with Options | MTBA | 60min |
OS | MS Windows 7 | MTBF | 168 hour |
SOFTWARE |
TTVIS10N AOI TTVISION OVS TTVISION ORM |
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DEFECTS INSPECTED |
Patterned Wafer | Contamination Ink Crack/Mesa Damage Metalization/Die Sawing Offset/Chipping Scratches/FM Pattern NG/Incomplete Cut DoubleCut |
COMMUNICATION | TCP/IP |
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OPERATING ENVIRONMENT |
Temperature | 15 - 24 Degree C |
Humidity | 30 - 80% |
Cleanroom | Class 10000 |
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| Bumped Wafer | Bump Size/Bump Defor mation/Bump Offset/ Bump Missing |
OPTIONS |
Reject Handling | Inking,Sorting |
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Offline Station | Reject Verification Recipe Management | INSPECTION MODE | 100% Sampling |
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Cleaning | Blow Vacuum | SAFETY | Interlocked Enclosure Jam Protection Lock-OutTag-Ou |
HEPA Filter | Class 1000 |
Communication | SECS/GEM |
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| FACILITIES |
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| Size(mm) | 1350(W) x 1100(D) x1700(H) |
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| Weight | 800 Kg |
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| Power | 230VAC,50Hz,13A, Single Phase |
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| CDA | 5 - 6 Bars,1CFM |