Malcom Reflow Simulator SRS-1C HAPOIN

Established in November 1999，we are committed to introducing high technology equipments, precision instruments, advanced production materials in order to improve the product quality at the domestic electronic manufacturing industries.

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Established in November 1999，we are committed to introducing high technology equipments, precision instruments, advanced production materials in order to improve the product quality at the domestic electronic manufacturing industries.
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Established in November 1999，we are committed to introducing high technology equipments, precision instruments, advanced production materials in order to improve the product quality at the domestic electronic manufacturing industries.
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Established in November 1999，we are committed to introducing high technology equipments, precision instruments, advanced production materials in order to improve the product quality at the domestic electronic manufacturing industries.
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Established in November 1999，we are committed to introducing high technology equipments, precision instruments, advanced production materials in order to improve the product quality at the domestic electronic manufacturing industries.

MALCOM SRS-1CReflow Simulator

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SRS-1C Feature:

· Using hot air and extreme infrared radiation underside together simulate the extremely near condition to the actual reflow oven

· Easy to set of the reflow heating condition and analyze the profile data with an exclusive software

· VIDEO CAMERA CAPTURE SYSTEMallows you to super-impose the real-time time/temp data onto the video image, then output the file and even save it.(Option)

· FILLET ANALYSIS SYSTEM simulates the near temperature profile to the actual reflow oven by hot air heating, evaluating the solderability with the fillet forms of CSP/BGA soldering bump height, width, chip parts (size 0402) and etc.(Option)

SRS-1C Specifications:

Applicable Circuit Board	Up to 70W x 70L x 10H mm
Outer Dimension	Main Unit : 320W x 285D x 310Hmm Controller unit : 290W x 235D x 270Hmm
Heating Method	Upper-face : Hot air Lower-face : Extreme infrared radiation
Cooling Method	Flowing air or N2 air (with flow adjustable valve)
Power Supply	200V 50/60Hz 3kVA 3Phase
Air	0.3 - 0.5MPa 100 liter/min (Maximum)
O2 Concentration in Furnace (when using N2)	100ppm minimum (Heating furnace is sealed up)
PCB Installation	Flat plate system
Upper-Heater	hot air heater : Approx. 2.8kW (Approx. 350W x 8 series) * Deviation to standard nozzle can be set.
Lower-Heater	Extreme infrared radiation heater : Approx. 360W
Temp. Accuracy	5C maximum (Maximum range : 50(W) x 50(L)mm in the center)
Measuring Temp. Range	Room temp. - 330C
Measuring Points	3points
N2 Gas Supply Function	25 liter/min. with flow regulating valve during operation
Control	Exclusive softwarefor Windows XP
Weight	Main unit : Approx. 12kg Controller unit : Approx. 8kg