Malcom Compact Reflow Oven RDT-165CP HAPOIN

Established in November 1999，we are committed to introducing high technology equipments, precision instruments, advanced production materials in order to improve the product quality at the domestic electronic manufacturing industries.

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Established in November 1999，we are committed to introducing high technology equipments, precision instruments, advanced production materials in order to improve the product quality at the domestic electronic manufacturing industries.
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Established in November 1999，we are committed to introducing high technology equipments, precision instruments, advanced production materials in order to improve the product quality at the domestic electronic manufacturing industries.
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Established in November 1999，we are committed to introducing high technology equipments, precision instruments, advanced production materials in order to improve the product quality at the domestic electronic manufacturing industries.
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Established in November 1999，we are committed to introducing high technology equipments, precision instruments, advanced production materials in order to improve the product quality at the domestic electronic manufacturing industries.

MALCOM RDT-165CPCompact Reflow Oven

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RDT-165CP Feature:

· Up to 10 profiles can be saved and uploaded (via special software & USB conncetion) to memory

· Up to 10 heating stages can be set-up to create your desired temperature profile

· When using multiple units, an intelligent function prevents the units from simultaneously consuming peaks of power at the same time

· Its low price and compact size allow the RDT-165CP to be efficiently utilized in many workspaces

· Adjustments can be made quickly and smoothly with its relatively easy interface

RDT-165CP Specifications:

	RDT-165CP-A	RDT-165CP-N
Applicable Circuit Board	Up to 200W x 165L x 20H (Upper) 15H mm (Lower) mm
Outer Dimension	460W x 735D x 1067H mm (Main Unit) 1327H mm (w/signal tower)
Heating Method	Upper-face : Extreme infrared radiation with hot air Lower-face : Extreme infrared radiation
Cooling Method	Underside cooling fan
Power Supply	200V 50/60Hz 7kVA 3Phase
Air	by flowing air (with flow adjustable valve) 0.3-0.5MPa 100 liter/min (Maximum)	by flowing N2 air (with flow adjustable valve) 0.3-0.5MPa 100 liter/min (Maximum)
PCB Installation	Net system or Carrier system (Selectable on request)
Upper-Heater	Extreme infrared radiation with hot air heater: 4.8kW (Approx.400W x 12 block) * Adjustments can be made using the Matrix Heating System
Lower-Heater	Extreme infrared radiation heater : Approx. 1kW (500W x 2)
Temp. Range	Room temp. - 330C
Control	Exclusive softwarefor Windows XP/2000
Weight	Approx. 85kg