Wafer DebonderFully Automatic Wafer Temporary Debonder
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    Fully Automatic Wafer Temporary Debonder:


    4"-8"/ 8"-12"wafer application.

    Thinner wafer capability

    Compatible wafer cassette / wafer box

    Used bonding tape robot peeling

    Automatic wafer mounting

    Built-in UV irradiating module

    PC based control with Windows OS

    Intelligent wafer mapping in cassette

    SECS/GEM or simple link capability

    Automatic bonded wafer aligning

    Thermal debonding device wafer &support wafer



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