SINTAIKE STK-8050Semi-Automatic Temporary Wafer Bonder
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    Semi-Automatic Temporary Wafer Bonder STK-8050 Main config

    Wafer Sizes : 4'& 6'& 8'

    Load/unload Methods:Manually load and unload wafers.

    Bonding Method:Vacuum Bonding

    Chuck:One specifically sized wafer matching one specifically sized   chuck stage

    Control Unit:PLC based control with 7' touch screen.

    UV Curer Unit:LED UV light.

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