MALCOM RMS-165LSIn-Line Compact Reflow Oven
  • Summary
  • Parameter
  • Application
  • Data
  • Related
  • Brand
  • Video

    RMS-165LS Feature:

    · Can set 10 patterns of heater setting from PC

    · The max. 10 stages of heater setting allows for the various temperature profiles

    · Malcom's unique heater matrix control makes it possible to solder even PC Board thermal capacity bad balance with the most suitable heating

    · Its compact size allows the workspace to be efficiently utilized. Low power consumption provides excellent cost-performance benefits

    · RMS-165LS built into line automates PC board conveyance

    RMS-165LS Specifications:

    Size of object Board

    Size: W165 x L 200(mm) 

    Hight: Maintain Upper: 20mm, Lower:15mm

    Equipment SizeW460 x D730 x H1067(mm)
    Heating method

    The upper surface :  Hot wind and far-infrared radiation and radiation using together :  Far-infrared radiation radiate

    Cooling methodLower propeller fan
    Power supply3 phase 200V 50/60Hz 7KVA
    External gas0.30.5Mpa 100ℓ/minMAX
    Board maintain methodBoth ends [pinch-n] support
    Heating peak temp330 (Measurement by our specification substrate)
    WeightApprox. 100g

    * The measuring accuracy does not include the error of thermocouple.

    * The maximum measuring time does not consider the thermal resistance, and this is not the time allowed for measurement inside the reflow furnace.

Follow us:

Copyright © 1999-2017 Hapoin Enterprise 沪 ICP 备 11051220 号 沪公网安备 31010502002237号All Rights Reservedbottom.png