RMS-165LS Feature:
· Can set 10 patterns of heater setting from PC
· The max. 10 stages of heater setting allows for the various temperature profiles
· Malcom's unique heater matrix control makes it possible to solder even PC Board thermal capacity bad balance with the most suitable heating
· Its compact size allows the workspace to be efficiently utilized. Low power consumption provides excellent cost-performance benefits
· RMS-165LS built into line automates PC board conveyance
RMS-165LS Specifications:
Model | RMS-165LS-A |
Size of object Board | Size: W165 x L 200(mm) Hight: Maintain Upper: 20mm, Lower:15mm |
Equipment Size | W460 x D730 x H1067(mm) |
Heating method | The upper surface : Hot wind and far-infrared radiation and radiation using together : Far-infrared radiation radiate |
Cooling method | Lower propeller fan |
Power supply | 3 phase 200V 50/60Hz 7KVA |
External gas | 0.3~0.5Mpa 100ℓ/min(MAX) |
Board maintain method | Both ends [pinch-n] support |
Heating peak temp | 330℃ (Measurement by our specification substrate) |
Weight | Approx. 100g |
* The measuring accuracy does not include the error of thermocouple.
* The maximum measuring time does not consider the thermal resistance, and this is not the time allowed for measurement inside the reflow furnace.