MALCOM SOLDER-PASTE PRINT INSPECTION SYSTEM TD-6A HAPOIN

Established in November 1999，we are committed to introducing high technology equipments, precision instruments, advanced production materials in order to improve the product quality at the domestic electronic manufacturing industries.

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Established in November 1999，we are committed to introducing high technology equipments, precision instruments, advanced production materials in order to improve the product quality at the domestic electronic manufacturing industries.
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Established in November 1999，we are committed to introducing high technology equipments, precision instruments, advanced production materials in order to improve the product quality at the domestic electronic manufacturing industries.
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Established in November 1999，we are committed to introducing high technology equipments, precision instruments, advanced production materials in order to improve the product quality at the domestic electronic manufacturing industries.

MALCOM TD-6ASOLDER-PASTE PRINT INSPECTION SYSTEM

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【Discontinued；Substitute：TD-7A】

● TD-6A Usage：

Automated table-top inspection system for measuring paste height, area, volume, and misprinting.

● TD-6A Feature：

・Active Slit-Laser scans the board, and displays a full 3D image.

・Multi-colored LED illuminates using 16.77 million colors, making it possible to measure various kinds of PC
Boards accurately.

・Gerber data program allows for speedy data inspection.

・A variety of 2D & 3D measurement functions can be selected according to user needs.

・SPC data analysis of the automated measurement data. (optional)

●TD-6A Specification：

Item		Specification
Model Name		TD-6A
Inspection	Object	Misprinting, Area, Height, Volume
	PCB Warpage Range	±3mm
	Measurement Range	5.85mm(W), 4.39mm(D), 50 - 300μm(H)
	Resolution	Approx. 5.2μm
	Approval / rejection function	Automatic inspection using color image processing. Automatically determines if paste meets user-specified standards using color image processing.
	Speed 2D	1sec. / field (5.85mm x 4.39mm)
	Speed 3D	7.5sec. / 6cubic mm (Resolution 5.2 x 20μm)
	Inspection Data Testing Method	Teaching data 150 frame / PCB, Gerber data conversion program
	Inspection Data Output	Test File format Available SPC Analysis software (Option)
	PCB Dimension	Minimum. : 50 x 50mm Max. : 250 x 330mm Thickness : 0.5 - 3.0mm
	Measurement Range Possible	240×320mm
Optical Section	Light Source1	Overhead RGB LED (16.77 million colors)
	Light Source2	Angled RGB LED (16.77 million colors)
	Light Source3	Semiconductor Laser
	Camera	High-speed & High-resolution color camera
	Camera Field	6.5 x 4.9mm
	Height Measuring Principle	Optical cutting triangular surveying by laser slit light, irradiation angle 45deg.
	Area Measuring Principle	Color image processing
	Slit-Laser	Semiconductor Laser : 8mm(W) x 10μm
	Safety Classification	Class 3B
Casing	Circuit board clamp table	Circuit board gripping allowance 3mm, both-side clamping is possible
	X axis	Stroke : 260mm
	Yaxis	troke : 340mm
	Zaxis	troke : ±5mm
	Outer Dimension	500(W) x 690(D) x 320(H) （mm）
	System	High-speed image processing computer system built in
	Weight	45kg
	Power Supply	AC100 - 240V, 50-60Hz, 450VA
	Interface	Universal serial bass USB x 2 Keyboard Input Mouse Input Monitor Output

* The above specifications are subject to change without notice.