MALCOM TD-4MSolder-Paste Print Inspection System
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    TD-4M Feature:

    · Minimum functions and high cost performance

    · Measure the height of solder paste using slit laser

    · A Colored CCD camera makes it possible for clear image inspection

    · Coordinates-Display-Function allows you to move PCB to the inspection position that you desire easily

    · Save data in USB memory

    · SPC data analysis of the automated measurement data.(optional)

    TD-4M Specifications:

    Measurement Specifications
    InspectionObjectThickness of printed solder paste
    PCB Warpage Range±1.5mm
    Measurement Range2mm(W), 3mm(D), 50 - 350μm(H)
    Judgment functionAutomatic OK/NG judgment
    Standard Position SettingTaking in PCB display image (One point)
    Speed1 second or less / visual field (Standard)
    DataInput method : Teaching, number of data : 150 fields
    OutputOutput to printer and in text files
    PCB DimensionOutside: 50 x 50mm min., 250 x 330mm max.
    Thickness: 0.5 - 2.0 mm
    Measurable range240×320mm 
    Optical SectionLight Source660nm semi-conductor laser
    Camera1/4-inch color CCD
    Camera Field4mm×3mm
    Measuring PrincipleOptical cutting triangular surveying by laser slit light, irradiation angle 45deg
    Cut slit20μm x 10mm
    Safety ClassificationClassification acc. to laser danger level: Class 2
    Main Unit Specifications
    PC Board clamp tableCircuit board gripping allowance 3mm,both-side clamping is possible
    Outer Dimension420(W) x 635(D) x 350(H) mm
    SystemHigh-speed image processing computer system built in
    Power SupplyAC100 - 240V, 50-60Hz, 140W (Service AC outlet not included)
    InterfaceUSB for printer

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