Malcom Solder-Paste Print Inspection System TD-4MHAPOIN

Established in November 1999，we are committed to introducing high technology equipments, precision instruments, advanced production materials in order to improve the product quality at the domestic electronic manufacturing industries.

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Established in November 1999，we are committed to introducing high technology equipments, precision instruments, advanced production materials in order to improve the product quality at the domestic electronic manufacturing industries.
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Established in November 1999，we are committed to introducing high technology equipments, precision instruments, advanced production materials in order to improve the product quality at the domestic electronic manufacturing industries.
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Established in November 1999，we are committed to introducing high technology equipments, precision instruments, advanced production materials in order to improve the product quality at the domestic electronic manufacturing industries.
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Established in November 1999，we are committed to introducing high technology equipments, precision instruments, advanced production materials in order to improve the product quality at the domestic electronic manufacturing industries.

MALCOM TD-4MSolder-Paste Print Inspection System

Summary
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TD-4M Feature:

· Minimum functions and high cost performance

· Measure the height of solder paste using slit laser

· A Colored CCD camera makes it possible for clear image inspection

· Coordinates-Display-Function allows you to move PCB to the inspection position that you desire easily

· Save data in USB memory

· SPC data analysis of the automated measurement data.(optional)

TD-4M Specifications:

Measurement Specifications
Inspection	Object	Thickness of printed solder paste
	PCB Warpage Range	±1.5mm
	Measurement Range	2mm(W), 3mm(D), 50 - 350μm(H)
	Resolution	8μm
	Judgment function	Automatic OK/NG judgment
	Standard Position Setting	Taking in PCB display image (One point)
	Speed	1 second or less / visual field (Standard)
	Data	Input method : Teaching, number of data : 150 fields
	Output	Output to printer and in text files
	PCB Dimension	Outside: 50 x 50mm min., 250 x 330mm max.
	PCB Dimension	Thickness: 0.5 - 2.0 mm
	Measurable range	240×320mm
Optical Section	Light Source	660nm semi-conductor laser
	Camera	1/4-inch color CCD
	Camera Field	4mm×3mm
	Measuring Principle	Optical cutting triangular surveying by laser slit light, irradiation angle 45deg
	Cut slit	20μm x 10mm
	Safety Classification	Classification acc. to laser danger level: Class 2
Main Unit Specifications
PC Board clamp table		Circuit board gripping allowance 3mm,both-side clamping is possible
Outer Dimension		420(W) x 635(D) x 350(H) mm
System		High-speed image processing computer system built in
Weight		22kg
Power Supply		AC100 - 240V, 50-60Hz, 140W (Service AC outlet not included)
Interface		USB for printer