TAMURA TLF204-205-HFPb-free Solder Paste
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    TLF204-205-HF Features:


    ·Reduce the area of voids

    ·Suppress voids on various component substrates

    ·Halogen free

    ·FLUX TYPE ROLO (J-STD-004C)

    ·Specialized for N2 reflow soldering


    TLF204-205-HF Parameter:

    ItemsTLF204-205-HFTest methods
    Alloy compositionSn/3.0/0.5Cu-
    Melting point(℃)216~220℃DSC

    Particle size of solder powder

    Type4(20-38μm)According to laser diffraction method
    Viscosity190 Pa·sJIS Z 3284
    Ti0.58JIS Z 3284
    Flux content11.1%JIS Z 3197
    Flux typeROLOIPC J-STD-004C
    Copper plate corrosion testNo corrosionIPC TM-650 2.6.15
    Copper mirror corrosion testNo corrosionIPC TM-650 2.3.32
    Insulation resistance testMore than 1.0×109ΩJIS Z 3197(85℃/85%)
    Electrochemical migration testNo electrochemical migrationJIS Z 3197(85℃/85%)
    Halide contentBr,Cl are below 900 ppmBS EN 14582
    Quality Guarantee Period180 daysStorage temperature:below 10℃.







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