Items | TLF204-205-HF | Test methods |
Alloy composition | Sn/3.0/0.5Cu | - |
Melting point(℃) | 216~220℃ | DSC |
Particle size of solder powder | Type4(20-38μm) | According to laser diffraction method |
Viscosity | 190 Pa·s | JIS Z 3284 |
Ti | 0.58 | JIS Z 3284 |
Flux content | 11.1% | JIS Z 3197 |
Flux type | ROLO | IPC J-STD-004C |
Copper plate corrosion test | No corrosion | IPC TM-650 2.6.15 |
Copper mirror corrosion test | No corrosion | IPC TM-650 2.3.32 |
Insulation resistance test | More than 1.0×109Ω | JIS Z 3197(85℃/85%) |
Electrochemical migration test | No electrochemical migration | JIS Z 3197(85℃/85%) |
Halide content | Br,Cl are below 900 ppm | BS EN 14582 |
Quality Guarantee Period | 180 days | Storage temperature:below 10℃. |