TAMURA TLF-204G-HFWPb-Free Solder Paste
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    LFSOLDER TLF-204G-HFW is a solder paste corresponding to N 2 reflow, consisting of high-reliability flux and Pb-free solder alloy fine powder with developed for printing fine parts. TLF-204G-HFW has stable printability for 0201-chip size pattern, enough tackiness to prevent parts mount error during mounting and excellent defluxibility of flux residue after reflow with semi-water-based cleaner.

     TLF-204G-HFW Features:

    1) A minute solder powder of 15μm or less is used.

    2) A stable printability for 0201-chip size pattern is possible.

    3) An excellent wettability is attained at fine patterns.

    4) Halogen-free flux is used.

    5) Flux residue after reflow can be removed by semi-water based cleaning solvents.

     TLF-204G-HFW Specification:



    Test   methods

    Alloy   composition


    JIS Z 3282(2006)

    Melting point


    According to   DSC measurement

    Particle size   of solder powder

    5~15 μm

    According to   laser diffraction method

    Flux content

    11.3 %

    JIS Z 3197(2012)

    Chlorine   content

    0.0  %

    JIS Z 3197(2012)


    190  Pa・s

    JIS Z 3284-3(2014)

    Viscometer,type     PCU, Manufactured by

    Malcom at 25℃

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