LFSOLDER TLF-204G-HFW is a solder paste corresponding to N 2 reflow, consisting of high-reliability flux and Pb-free solder alloy fine powder with developed for printing fine parts. TLF-204G-HFW has stable printability for 0201-chip size pattern, enough tackiness to prevent parts mount error during mounting and excellent defluxibility of flux residue after reflow with semi-water-based cleaner.
1) A minute solder powder of 15μm or less is used.
2) A stable printability for 0201-chip size pattern is possible.
3) An excellent wettability is attained at fine patterns.
4) Halogen-free flux is used.
5) Flux residue after reflow can be removed by semi-water based cleaning solvents.