TAMURA TLF-204-MDSPb-Free Solder Paste
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    TLF-204-MDS Features:

    · Pb-free (Sn/Ag/Cu series) solder alloy

    · Stable printability with little change in viscosity during continuous printing

    · Reduces void formation

    · Reduces mid-chip solder balls

    · Does not slump in pre-heat

    · Excellent solderability at high temperature

    · Excellent solderability for 0.4mm pitch BGA

    TLF-204-MDS Parameter:

    ItemsTLF-204-MDSTest method
    Alloy compositionSn96.5/Ag3.0/Cu 0.5JIS Z 3282 (1999)
    Melting point (℃)216~220DSC
    Particle size (μm)25~38Laser diffractometry
    Shape of solder powdersphericalJIS Z 3284
    Flux content (%)10.9JIS Z 3284 (1994)
    Chlorine content (%)0.0

    JIS Z 3197 (1999)

    Viscosity (Pa・s)195JIS Z 3284 (1994)


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