TLF-204-MDS Features:

· Pb-free (Sn/Ag/Cu series) solder alloy

· Stable printability with little change in viscosity during continuous printing

· Reduces void formation

· Reduces mid-chip solder balls

· Does not slump in pre-heat

· Excellent solderability at high temperature

· Excellent solderability for 0.4mm pitch BGA

TLF-204-MDS Parameter:

• TAMURATLF-204-93IVT(SH)
  
  TLF-204-93IVT(SH) is a Pb-free, no-clean solder paste using Pb-free, spherical solder powder and special flux.
• TAMURATLF-204-171
  
  TLF-204-171 is a Pb-free and cleaning-free solder paste used Pb-free spherical solder powder and special flux.
• TAMURATLF-204-NH
  
  TLF-204-NF using unleaded solder alloys (tin, silver, copper) using halogen-free solder flux
• TAMURATLF-204-NH(20-36)
  
  LFSOLDER TLF-204-NH(20-36) is the Pb-free and Halogen-free solder paste which it used spherical Pb-free solder powder and the halogen-free flux.
• TAMURATLF-204-93K
  
  Pb-FREE SOLDER PASTE TLF-SERIES LFSOLDER TLF-204-93K
• TAMURATLF-204-93
  
  Pb-FREE SOLDER PASTE TLF-SERIES LFSOLDER TLF-204-93