TAMURA TLF-204-93IVT(SH)Pb-Free Solder Paste
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    TLF-204-93IVT(SH) Features:

    · Pb-free (Sn/Ag/Cu series) solder alloy

    · Stable printability with little change in viscosity during continuous printing

    · Reduces void formatin

    · Reduces mid-chip solder balls

    · Does not slump in pre-heat

    · Excellent solderability at high temperature

    · Excellent solderability on fine pitch patterns of 0.5mm pitch CSP

    TLF-204-93IVT(SH) Parameter:

    ItemsTLF-204-93IVT(SH) Test method
    Alloy compositionSn96.5/Ag3.0/Cu0.5JIS Z 3282(1999)
    Melting point (℃)216~220DSC
    Particle size (μm)25~38Laser diffractometry
    Shape of solder powderSphericalJIS Z 3284(1994)
    Flux content (%)10.9JIS Z 3284(1994)
    Chlorine content (%)0.0JIS Z 3284(1994)
    Viscosity (Pa・s)200JIS Z 3284(1994)

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