LFSOLDER TLF-204-27F4 is a solder paste, using special flux and spherical solder powder of Pb-free (SnAgCu).
As the paste contains no Pb, it will largely contribute to the protection of global environment. Furthermore,
excellent reliability can be obtained with the flux without cleaning. Also, residual flux after reflow can be
removed by hydrocarbon cleaning solvent and semi-water based cleaning solvent etc.
a) Pb-free (Sn/Ag/Cu series) solder alloy is used.
b) Residual flux after reflow can be removed by hydrocarbon cleaning solvent and semi-water based cleaning
solvent etc.
c) Excellent printability with fine pattern of 0.4mm-Pitch can be obtained.
d) Being very good in solderability, an adequate wettability is shown for the land and parts.
e) Excellent solderability can be attained for a high peak temperature.