TAMURA TLF-204-171Pb-Free Solder Paste
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    TLF-204-171 Features:

    · Pb-free (Sn/Ag/Cu series) alloy solder is used

    · Stable printability and shape of the printed solder paste are obtained with little change in viscosity during continuous printing

    · Excellent wettability for electronic component and land pattern

    · Excellent solderability is brought with the reflow profile with high peak temperature

    · Superior reliability is ensured without cleaning the flux residue


    TLF-204-171 Parameter:

    ItemsTLF-204-171Test methods
    Alloy compositionSn96.5/Ag3.0/Cu0.5JIS Z 3282 (1999)
    Melting point(℃)216~220DSC

    Particle size (μm)

    20~36Laser diffraction method
    Shape of solder powderSphericalJIS Z 3284 (1994)
    Flux content(%)12.1JIS Z 3284 (1994)
    Chlorine content(%)Less than 0.05JIS Z 3197 (1999)
    Viscosity(Pa・s)190JIS Z 3284 (1994)


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