TAMURA TLF-204-171 Pb-Free Solder Paste HAPOIN

Established in November 1999，we are committed to introducing high technology equipments, precision instruments, advanced production materials in order to improve the product quality at the domestic electronic manufacturing industries.

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Established in November 1999，we are committed to introducing high technology equipments, precision instruments, advanced production materials in order to improve the product quality at the domestic electronic manufacturing industries.
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Established in November 1999，we are committed to introducing high technology equipments, precision instruments, advanced production materials in order to improve the product quality at the domestic electronic manufacturing industries.
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Established in November 1999，we are committed to introducing high technology equipments, precision instruments, advanced production materials in order to improve the product quality at the domestic electronic manufacturing industries.
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Established in November 1999，we are committed to introducing high technology equipments, precision instruments, advanced production materials in order to improve the product quality at the domestic electronic manufacturing industries.

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TAMURA TLF-204-171Pb-Free Solder Paste

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TLF-204-171 Features:

· Pb-free (Sn/Ag/Cu series) alloy solder is used

· Stable printability and shape of the printed solder paste are obtained with little change in viscosity during continuous printing

· Excellent wettability for electronic component and land pattern

· Excellent solderability is brought with the reflow profile with high peak temperature

· Superior reliability is ensured without cleaning the flux residue

TLF-204-171 Parameter:

Items	TLF-204-171	Test methods
Alloy composition	Sn96.5/Ag3.0/Cu0.5	JIS Z 3282 (1999)
Melting point(℃)	216～220	DSC
Particle size (μm)	20～36	Laser diffraction method
Shape of solder powder	Spherical	JIS Z 3284 (1994)
Flux content(%)	12.1	JIS Z 3284 (1994)
Chlorine content(%)	Less than 0.05	JIS Z 3197 (1999)
Viscosity(Pa･s)	190	JIS Z 3284 (1994)