TAMURA Pb-FREE SOLDER TLF-204-167 HAPOIN

Established in November 1999，we are committed to introducing high technology equipments, precision instruments, advanced production materials in order to improve the product quality at the domestic electronic manufacturing industries.

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Established in November 1999，we are committed to introducing high technology equipments, precision instruments, advanced production materials in order to improve the product quality at the domestic electronic manufacturing industries.
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Established in November 1999，we are committed to introducing high technology equipments, precision instruments, advanced production materials in order to improve the product quality at the domestic electronic manufacturing industries.
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Established in November 1999，we are committed to introducing high technology equipments, precision instruments, advanced production materials in order to improve the product quality at the domestic electronic manufacturing industries.
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Established in November 1999，we are committed to introducing high technology equipments, precision instruments, advanced production materials in order to improve the product quality at the domestic electronic manufacturing industries.

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TAMURA TLF-204-167Pb-FREE SOLDER

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LFSOLDER TLF-204-167 is a Pb-free and cleaning-free solder paste used Pb-free spherical solder

powder and special flux. Since this solder paste contains no Pb, the usage of hazardous materials is

reduced, furthermore, the environment and the safe workplace are protected. As its flux residue contains no halides, it can be remained on the PCB without cleaning.

● TLF-204-167Features：

・Pb-free (Sn/Ag/Cu series) alloy solder is used.

・Stable printability and shape of the printed solder paste are obtained with little change in viscosity during continuous printing.

・Chip-side ball seldom occur.

・Excellent solderability at high temperature.

・Superior reliability is ensured without cleaning the flux residue.

● TLF-204-167　Specification：

Items	Characteristics	Test methods
Alloy composition	Sn 96.5 / Ag 3.0/ Cu 0.5	JIS Z 3282 (1999)
Melting point	216～220℃	DSC measurement
Particle size of solder powder	20-38μm	Laser diffraction method
Shape of solder powder	Spherical	Annex 1 to JIS Z 3284 (1994)
Flux content	11.70%	JIS Z 3284 (1994)
Chlorine content*	0.00%	JIS Z 3197 (1999)
Viscosity	200 Pa·s	Annex 6 to JIS Z 3284 (1994)
		Viscometer type PCU-205
		manufactured by Malcom, at 25℃