TLF-204-111M Features:

· Pb-free (Sn/Ag/Cu series) solder alloy is used

· Stable printability is obtained with little change in viscosity during continuous printing

· It is excellent effective for void decrement

· Chip-side ball seldom occur

· In preheating, the possibility of slump is very rare

· Excellent solderability can be attained for a high peak temperature

· Excellent solderability can be attained at small pattern of 0.5 mm pitch CSP

TLF-204-111M Parameter:

• TAMURATLF-204-NH
  
  TLF-204-NF using unleaded solder alloys (tin, silver, copper) using halogen-free solder flux
• TAMURATLF-204-171
  
  TLF-204-171 is a Pb-free and cleaning-free solder paste used Pb-free spherical solder powder and special flux.
• TAMURATLF-204-93IVT(SH)
  
  TLF-204-93IVT(SH) is a Pb-free, no-clean solder paste using Pb-free, spherical solder powder and special flux.
• TAMURATLF-204-MDS
  
  TLF-204-MDS is a Pb-free, no-clean solder paste using Pb-free, spherical solder powder and special flux.
• TAMURATLF-204-NH(20-36)
  
  LFSOLDER TLF-204-NH(20-36) is the Pb-free and Halogen-free solder paste which it used spherical Pb-free solder powder and the halogen-free flux.
• TAMURATLF-204-167
  
  TAMURA Pb-FREE SOLDER TLF-204-167