TLF-204-111A Features:
· Pb-free (Sn/Ag/Cu series) solder alloy is used
· Stable printability is obtained with little change in viscosity during continuous printing
· It is excellent effective for void decrement
· Excellent solderability can be attained for a high peak temperature
· Excellent solderability can be attained at small pattern of 0.5mm pitch CSP
· The amount of flux dispersion can be reduced for gold plated board etc
· Excellent solderability can be attained for gold pad
· Chip-side ball seldom occur
TLF-204-111A Parameter:
Items | TLF-204-111A | Test method |
Alloy composition | Sn96.5/Ag3.0/Cu0.5 | JIS Z 3282(1999) |
Melting point (℃) | 216~220 | DSC |
Particle size (μm) | 25~40 | According to laser diffraction method |
Shape of solder powder | Spherical | JIS Z 3284(1994) |
Flux content (%) | 11.6 | JIS Z 3284(1994) |
Chlorine content (%) | Less than 0.1 | JIS Z 3197(1986) |
Viscosity (Pa・s) | 215 | JIS Z 3284(1994) |
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