TAMURA TAP30-427EMReflow Soldering
  • Summary
  • Parameter
  • Application
  • Data
  • Related
  • Brand
  • Video

    TAP30-427EM Feature:

    · Heating efficiency has been improved by ten percent by the new blast hot air blow layout to accomplish smaller

    · The ease of operation and peripheral devices on the control panel. (CD-ROM, mouse)

    · Improved maintainability by the new flux management capability

    · Multi-language selection on operation panel(English, Chinese and Japanese)

    · Useful functions of data filing of histories of equipment, production, etc

    TAP30-427EM Parameter:

    Applicable boards

    MAX. 300×L330 (mm)  

    MIN. 50×L50 (mm)

    Component height

    Upper MAX. 30mm

    Lower MIN. 30mm

    Circuit board put allowance4mm
    N2 Gas supply900±20mm
    Power source

    AC 200V-50/60Hz-3  26kVA 76A  

    (at flipflop start)

    Dimensions of machineW1310×L4200×H1370 (mm)

    approx. 1500kg

Follow us:

Copyright © 1999-2024 Hapoin Enterprise 沪 ICP 备 11051220 号 沪公网安备 31010502002237号All Rights Reservedbottom.png