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    TLF-206-93F Features:

    · Pb-free (Sn/Ag/Cu series) solder alloy is used

    · Excellent solderability can be attained at small of 0.5mm pitch CSP

    · Stable printability is obtained with little change in viscosity during continuous printing

    · High reliability flux that conforms to J-STD class L0 flux is used

    · Having a good solderability, adequate wettability is shown on various parts

    · Excellent solderability can be attained for a high peak temperature

    TLF-206-93F Parameter:

    ItemsTLF-206-93FTest methods
    Alloy compositionSn96.5/Ag3.0/Cu0.5JIS Z 3282(1999)
    Melting point216~220℃DSC
    Particle size of solder powder20~38μmAccording to laser diffraction method
    Shape of solder powderSphericalJIS Z 3284(1994)
    Flux content11.9%JIS Z 3284(1994)
    Chlorine content0.0%JIS Z 3197(1999)
    Viscosity190Pa・sJIS Z 3284(1994)

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