TLF-206-107 Features:

· Pb-free (Sn/Ag/Cu series) solder alloy

· Stable printability with little change in viscosity during continuous printing

· Stable printability for high print

· Stable printability after pause on the stencil

· Reduces void formatin

· Does not slump in pre-heat

· Excellent solderability at high temperature

· Excellent solderability for 0.4mm pithch BGA

TLF-206-107 Parameter:

• TAMURATLF-401-11
  
  TLF-401-11 is the Pb-free solder paste using Pb-free, Sn/Bi series low melting type solder powder and special flux. As the paste contains no Pb, it will largely contribute to the protection of global environment.Furthermore,excellent reliability can be obtained with the flux without washing.
• TAMURATLF-801-17
  
  TLF-801-17 is Pb-free solder paste using Pb-free, spherical solder powder and special flux. As the paste contains no Pb, it will largely contribute to the protection of global environment. The melting point of this alloy is close to the Sn/Pb eutectic solder, because this solder paste is composed of Sn/Ag/Bi/In solder alloy. In result, current reflow conditions can be applied.
• TAMURATLF-206-93F
  
  TLF-206-93F is a Pb-free, no-clean solder paste using Pb-free, spherical solder powder and special flux. As the paste contains no Pb, it will largely contribute to the protection of global environment. Furthermore, excellent reliability can be obtained with the flux without washing.
• TAMURATLF-204-111M
  
  TLF-204-111M is Pb-free solder paste using Pb-free, shperical solder powder and special flux. As excellent reliability can be obtained with the flux without washing.
• TAMURATLF-204-111A
  
  TLF-204-111A is Pb-free solder paste using Pb-free, spherical solder powder and special flux. As the paste contains no Pb, it will largely contribute to the protection of global environment.
• TAMURATLF-204-167
  
  TAMURA Pb-FREE SOLDER TLF-204-167