TAMURA TLF-401-11Pb-Free Solder Paste
  • Summary
  • Parameter
  • Application
  • Data
  • Related
  • Brand
  • Video


    TLF-401-11 Feature:

    · Pb-free (Sn/Bi series) solder alloy is used

    · It is possible to soldering by air reflow

    · It is possible to soldering that the soldering temperature is lower than Sn/Pb eutectic

    · Stable printability is obtained with little change in viscosity during continuous printing

    · Having a good solderability, adequate wettability is shown on various parts

    TLF-401-11 Parameter:

    ItemsTLF-401-11Test methods
    Alloy compositionSn42.0/Bi 58.0JIS Z 3282(1999)
    Melting point139 ℃使用DSC检测
    Particle size of solder powder25~45μm使用雷射光折射法
    Flux content9.5%JIS Z 3284(1994)
    Chlorine content0.0%JIS Z 3197(1999)
    Viscosity210 Pa.s

    JIS Z 3284(1994)

Follow us:

Copyright © 1999-2024 Hapoin Enterprise 沪 ICP 备 11051220 号 沪公网安备 31010502002237号All Rights Reservedbottom.png