PS37BR-600A-MW3 Features:
Harima’s quick response to the demand of low melting point paste
To prevent global warming,activities to consider low melting solder accelerates. CO₂ emission,one of the main culprits responsible for global warming,can be reduced by low electricity consumprion of the reflow oven.snbi(Ag) alloy is chosen as a representative of low melting solder alloy.For its representative solder alloy,Harima has various low temp solder alloy as can be seen in below table.
Melting point | Alloy composition | Product name |
219℃ | Sn-3.0Ag-0.5Cu | PS31BR-600A-HLSP |
214℃ | Sn-3.5Ag-3.0In-0.5Bi | PS32BR-600A-MF2 |
210℃ | Sn-3.5Ag-4.0In-0.5Bi | PS38BR-600A-ST4 |
207℃ | Sn-3.5Ag-8.0In-0.5Bi | PS37BR-600A-MW3 |
138℃ | Sn-58Bi | PS58BR-450A-KL1 |
137℃ | Sn-57Bi-1Ag | PS57BR-600A-KL2 |
Sn-Bi(-Ag)solder paste
Harima debeloped solder paste with low melting point solder alloy by optimizing the activator in the flux.It has excellent wettability and can be used under the low temperature profile.