HARIMA PS37BR-600A-MW3Low temperature solder paste
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    PS37BR-600A-MW3 Features:

    Harima’s quick response to the demand of low melting point paste

    To prevent global warming,activities to consider low melting solder accelerates. CO₂ emission,one of the main culprits responsible for global warming,can be reduced by low electricity consumprion of the reflow oven.snbi(Ag) alloy is chosen as a representative of low melting solder alloy.For its representative solder alloy,Harima has various low temp solder alloy as can be seen in below table.

    Melting point

    Alloy composition

    Product name

    219℃

    Sn-3.0Ag-0.5Cu

    PS31BR-600A-HLSP

    214℃

    Sn-3.5Ag-3.0In-0.5Bi

    PS32BR-600A-MF2

    210℃

    Sn-3.5Ag-4.0In-0.5Bi

    PS38BR-600A-ST4

    207℃

    Sn-3.5Ag-8.0In-0.5Bi

    PS37BR-600A-MW3

    138℃

    Sn-58Bi

    PS58BR-450A-KL1

    137℃

    Sn-57Bi-1Ag

    PS57BR-600A-KL2

    Sn-Bi(-Ag)solder paste

    Harima debeloped solder paste with low melting point solder alloy by optimizing the activator in the flux.It has excellent wettability and can be used under the low temperature profile.


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