SQ-20-27 Features:

· An excellent printability can be obtained for a fine pattern of 0.3 mm pitch

· Stable printability is obtained with little change in viscosity during continuous printing

· There is hardly the occurrence of the bridge, because there is little slump in pre-heating

· It has a superior effect on Tombstone phenomenon

SQ-20-27 Parameter:

• TAMURASQ-20-49
  
  SQ-20-49 is a solder paste designed for in-circuit tester, using special flux and spherical solder powder with little oxides to reduce chip side balls. Having a good solderability, adequate wettability is shown on various parts. With excellent resolution and stability in continuous printing, fine patterns of 0.4mm pitches can be printed with good precision.
• TAMURASQ-20-25FC
  
  SQ-20-25FC is a solder paste using a special flux developed for air reflow and less oxide spherical solder powder of special alloy composition.
• TAMURARMA-012-FP
  
  RMA-012-FP is a solder paste consisting of spherical solder powders with a special alloy composition. This solder paste has a superior effect on preventing tombstone phenomenon.