TAMURA SQ-20-25FCLead Paste
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    SQ-20-25FC Features:

    · Excellent printability is achieved for 0.3mm pitch fine patterns

    · Stable printability is achieved because little change with the passage of time during continuous printing

    · No occurrence of bridges because there is little slump during preheating

    · Highly effective for the prevention of tombstone phenomenon

    · Almost no viscosity change with the passage of time and excellent storage stability

    · An appearance inspection equipment can be used because the solder surface after reflow is evenly mat surface

    SQ-20-25FC Parameter:



    Test method
    Alloy compositionSn62.8/Pb38.8/Ag0.4JIS Z 3282
    Melting point (℃)179~183℃DSC
    Particle size (μm)20∼38Laser Diffraction Method
    Shape of solder powderSpherical JIS Z 3284
    Flux content (%)10.5±0.3%JIS Z 3284
    Halide content (%)10.5±0.3% (in flux)JIS Z 3284
    Viscosity (Pa・s)180±20JIS Z 3284 

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