【Discontinued】

SQ-20-25FC Features:

· Excellent printability is achieved for 0.3mm pitch fine patterns

· Stable printability is achieved because little change with the passage of time during continuous printing

· No occurrence of bridges because there is little slump during preheating

· Highly effective for the prevention of tombstone phenomenon

· Almost no viscosity change with the passage of time and excellent storage stability

· An appearance inspection equipment can be used because the solder surface after reflow is evenly mat surface

SQ-20-25FC Parameter:

• TAMURARMA-010-FP
  
  This paste, using high-thixotropic flux, has an excellent resolution and continuous printability, and ensures stable printing of 0.3mm fine pitch patterns for QFPs.
• TAMURASQ-20-49
  
  SQ-20-49 is a solder paste designed for in-circuit tester, using special flux and spherical solder powder with little oxides to reduce chip side balls. Having a good solderability, adequate wettability is shown on various parts. With excellent resolution and stability in continuous printing, fine patterns of 0.4mm pitches can be printed with good precision.
• TAMURASQ-20-27
  
  SOLDER PASTE SQ-20-27 is a solder paste consisting of flux newly developed for air reflow used and spherical solder powder with special alloy organization. This solder paste has an excellent effect in tombstone phenomenon. Fine patterns of QFP can be printed with good precision in continuous printing, because the flux newly developed is giving proper thixotropic to the printing. Furthermore, it has the effect that restrains the bridge, because there is little slump in pre-heating.