TAMURA RMA-20-21ALead Paste
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    RMA-20-21A Features:

    · With good solderability, adequate wettability is demonstrated for a variety of parts

    · Excellent in preservation stability having practically no secular change in viscosity

    · A stable printability can be obtained with little secular change during continuous printing

    · An excellent printability can be obtained for a fine pattern of 0.3mm pitch

    RMA-20-21A Parameter:

    ItemsRMA-20-21ATest methods 
    Alloy compositionSn62.8/Pb36.8/Ag0.4JIS Z 3282(1986)
    Melting point179~183℃According to DSC measurement
    Particle size of solder22-38μmAccording to laser diffraction method 
    Shape of solder powderSphericalJIS Z 3284(1994)
    Flux content9.8%JIS Z 3284(1994)
    Chlorine content 0.0%JIS Z 3197(1994) 

    JIS Z 3284(1994) 

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