TAMURA RMA-020-FPLead Paste
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    RMA-020-FP Features:

    · Good for 0.3 to 1.0 mm pitch printing

    · Able to form stable solder fillets on QFP lead and faces

    · Able to form fillets enough even on parts with poor solderability

    · Hardly solder balls occur

    · Very excellent in penetrativeness, and most suitable for fine pattern printing

    RMA-020-FP Parameter:

    ItemsNC7-E5-200BTest methods 
    Alloy compositionSn62/Pb36/Ag2JIS Z 3282(1986)
    Melting point179℃According to DSC measurement
    Particle size of solder22-45μmAccording to laser diffraction method 
    Shape of solder powderSphericalJIS Z 3284(1994)
    Flux content9.5±0.3%JIS Z 3284(1994)
    Chlorine content 0.13±0.01 %(in flux non-volatile)JIS Z 3197(1999) 

    JIS Z 3284(1994) 

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