RMA-010-FP Features:

· It has a good printability for 0.3 to 1.0  mm pitch

· It can form a stable solder fillet on the end face of QFP lead

· Adequate fillet can be formed even on parts with inferior wettability

· Hardly solder balls occur

· Very excellent in penetrativeness and most suitable for fine pattern printing

RMA-010-FP Parameter:

• TAMURARMA-012-FP
  
  RMA-012-FP is a solder paste consisting of spherical solder powders with a special alloy composition. This solder paste has a superior effect on preventing tombstone phenomenon.
• TAMURARMA-20-31
  
  RMA-20-31is a solder paste designed for “in-circuit” testers, using special flux and spherical solder powder with little oxides to reduce “chip aside” balls. Scattering of flux after reflow is limited with the past. With excellent resolution and stability in continuous printing, fine patterns of 0.4mm pitches can be printed with good precision.
• TAMURARMA-20-21T
  
  RMA-20-21T is a solder paste consisting of special RMA flux and spherical solder powder with little oxides. With excellent resolution and stability in continuous printing, fine patterns of 0.3mm pitches can be printed with good precision. Furthermore, the flux being equivalent to RMA conforming to MIL-F-14256F, an excellent reliability can be obtained without washing.