TAMURA TLF-204-NH(20-36)Pb-Free Solder Paste
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     TLF-204-NH(20-36)Introduction:

    LFSOLDER TLF-204-NH(20-36) is the Pb-free and Halogen-free solder paste which it used spherical Pb-free solder powder and the halogen-free flux. Also,after reflow,the flux residue of this paste becomes with halogen free,because it does not include halogen.As the paste contains no Pb,it will largely contribute to the protection of global environment.Furthermore,excellent reliability can be obtained with the flux without washing.


     TLF-204-NH(20-36)Features:

    ·Pb-free(Sn/Ag/Cu series)solder alloy is used.

    ·Halogen-free flux is used.

    ·Stable printability with little change in viscosity during continuous printing.

    ·Having a good solderability even in air reflow.

    ·Excellent solderability can be attained for a high peak temperature.

    ·Superior reliability is provided by no washing.


     TLF-204-NH(20-36)Specifications:

    Items

    Characteristics

    Test methods

    Alloy composition

    Sn 96.5 / Ag 3.0 / Cu 0.5

    JIS Z 3282(1999)

    Melting point

    216~220℃

    According to DSC

    measurement

    Particle size of

    Solder powder

    20~36μm

    According to laser

    Diffraction method

    Flux content

    11.8 %

    JIS Z 3284(1994)

    Chlorine content

    0.0 %

    JIS Z 3197(1999)

    Viscosity

    200 Pa·s

    Annex6 to JIS Z 3284(1994)

    Viscometer,type PCU,

    manufactured by Malcom,at 25℃


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