LFSOLDER GP-213-NH15S is the “Pb-free, halogen-free* and cleaning-free” solder paste. It’s made by Pb-free spherical solder powder and special flux. Since this solder paste contains neither Pb nor halogen*, the usage of hazardous materials is reduced, furthermore, the environment and the safe workplace are protected.
*It is according as the regulation of IEC61249-2-21.
1) Pb-free (Sn98.3 /Ag1.0/Cu0.7) solder alloy is used.
2) The cost is suppressed by the lower silver content.
3) Stabale printability and shape of the printed solder paste are obtained with little change in viscosity during continuous printing.
4) This paste is using “high reliability” and “halogen* free flux”.
5) Produce excellent wettability same as a halogen-contained Paste.
6) Heat slump is not almost observed during preheating.
7) Non-wetting of BGA joint is reduced by using new activator.