TAMURA GP-213-NH15SPb-FREE SOLDER PASTE
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    LFSOLDER GP-213-NH15S is the “Pb-free, halogen-free* and cleaning-free” solder paste. It’s made by Pb-free spherical solder powder and special flux. Since this solder paste contains neither Pb nor halogen*, the usage of hazardous materials is reduced, furthermore, the environment and the safe workplace are protected.

    *It is according as the regulation of IEC61249-2-21.


     GP-213-NH15S Features:

    1) Pb-free (Sn98.3 /Ag1.0/Cu0.7) solder alloy is used.

    2) The cost is suppressed by the lower silver content.

    3) Stabale printability and shape of the printed solder paste are obtained with little change in viscosity during continuous printing.

    4) This paste is using “high reliability” and “halogen* free flux”.

    5) Produce excellent wettability same as a halogen-contained Paste.

    6) Heat slump is not almost observed during preheating.

    7) Non-wetting of BGA joint is reduced by using new activator.


     GP-213-NH15S Specifications:

    Items

    Characteristics

    Test methods

    Alloy composition

    Sn98.3/Ag1.0/Cu0.7

    JIS Z 3282(1999)

    Melting point

    217~223℃

    According to DSC measurement

    Particle size of solder powder

    20-36µm

    According to laser diffraction method

    Shape of solder powder

    Spherical

    Annex 1 to JIS Z 3284 (1994)

    Flux content

    11.8 %

    JIS Z 3284 (1994)

    Chlorine content ※

    0.0%

    JIS Z 3197 (1999)

    Viscosity

    200Pa・s

    Annex 6 to JIS Z 3284 (1994) Viscometer, type PCU,   manufactured by Malcom., at 25℃


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