HIOKI FLYING PROBE TESTER FA1240-61/FA1240-63 HAPOIN

Established in November 1999，we are committed to introducing high technology equipments, precision instruments, advanced production materials in order to improve the product quality at the domestic electronic manufacturing industries.

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Established in November 1999，we are committed to introducing high technology equipments, precision instruments, advanced production materials in order to improve the product quality at the domestic electronic manufacturing industries.
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Established in November 1999，we are committed to introducing high technology equipments, precision instruments, advanced production materials in order to improve the product quality at the domestic electronic manufacturing industries.
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Established in November 1999，we are committed to introducing high technology equipments, precision instruments, advanced production materials in order to improve the product quality at the domestic electronic manufacturing industries.
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Established in November 1999，we are committed to introducing high technology equipments, precision instruments, advanced production materials in order to improve the product quality at the domestic electronic manufacturing industries.

HIOKI FA1240-61/FA1240-63FLYING PROBE TESTER

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● FA1240-61/63 Features：

• Quickly complete programs that take into account component height

• Automatic calculation of arm interference (when used with the UA1780)

• Designed to improve probe replaceability, dramatically reducing system downtime caused by probe replacement.

• High-speed testing at up to 0.025 sec./step

• Detection of IC lead float and pseudo-contact states

• Support for active testing (optional feature)

• High-precision probing

• Large testing area of 510 × 460 mm (FA1240-61)

• Standard transport capability

• Automatic alignment function and simple visual test function

● FA1240-61/63 Specifications：

	FA1240-61	FA1240-63
Number of arms	4 (L, ML, MR, R)
Number of test steps	40,000 (max.)
Measurement ranges	Resistance: 400 μΩ to 40 MΩ Capacitance: 1 pF to 400 mF Inductance: 1 μH to 100 H Diode VZ measurement: 0 to 25 V Zener diode VZ measurement: 0 to 25 V, 25 to 80 V (optional feature) Digital transistors: 0 to 25 V Photo couplers: 0 to 25 V Short: 0.4 Ω to 400 kΩ Open: 4 Ω to 40 MΩ DC voltage measurement: 0 to 25 V
Measurement time	Max. 0.025 sec./step	Max. 0.025 sec./step
Probing precision	Within ±100 μm for each arm (X and Y directions)
Positioning repeatability	Within ±50 μm (probing positions)
Inter-probe pitch	Min. 0.15 mm Min. 0.5 mm (when using 4-terminal probes)	Min. 0.15 mm Min. 0.5 mm (when using 4-terminal probes)
Testable board dimensions	510 mm (20.08 in) W × 460 mm (18.11 in) D	400 mm (15.75 in) W × 330 mm (12.99 in) D
Power supply	200 V AC (single-phase), 50/60 Hz, 6 kVA (FA1241: 230 V AC)	200 V AC (single-phase), 50/60 Hz,5 kVA
Dimensions and mass	1406 mm (55.35 in) H × 1300 mm (51.18 in) H × 1380 mm (54.33 in) D, 1150 kg (40,564.4 oz)	1266 mm (49.84 in) H × 1369 mm (53.90 in) H × 1425 mm (56.10 in) D, 1050 kg (37,037 oz)