TAMURA ULF-300RFlux
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    ULF-300R Features:

    · Very little flux residue after soldering

    · Very little flux residue remain on the carrier finger of wave soldering machine

    · No troubles like checker pin will be caused

    · Uniform flux coating can be achieved by foaming or spraying



    ULF-300R Parameter:

    ItemsULF-300RTest method
    AppearanceLight yellow and transparent liquidVisual examination
    Color number8Gardener method
    Specific gravity0.818JIS Z 3197(1986)
    Viscosity (mPa.s)4.3JIS Z 3197(1986)
    Solid content(%)12100℃,1h
    Chlorine content(%)0.08JIS Z 3197(1986)
    Spreading factor(%)92JIS Z 3197(1986)
    Copper plate corrosionPassingJIS Z 3197(1986)
    Water extract resistivity  (Ω・cm)1×1011JIS Z 3197(1986)


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