English
Established in November 1999，we are committed to introducing high technology equipments, precision instruments, advanced production materials in order to improve the product quality at the domestic electronic manufacturing industries.
Product Service
  • Precision Measurement
  • Semiconductor
  • Science Device
  • Reliability Testing Equipment
  • Production
  • Soldering Materials
  • SAC305
  • PbFree
  • LowTemperatures
  • LowSilver
  • Halogenfree
  • Leadpaste
  • Solderwire
  • Flux
  • Clean
  • UV Inks
  • Arzerite
  • Repair Equipment
  • Equipment Accessories
    • TAMURA ULF-300RFlux
    • Summary
    • Parameter
    • Application
    • Data
    • Related
    • Brand
    • Video

      ULF-300R Features:

      · Very little flux residue after soldering

      · Very little flux residue remain on the carrier finger of wave soldering machine

      · No troubles like checker pin will be caused

      · Uniform flux coating can be achieved by foaming or spraying



      ULF-300R Parameter:

      ItemsULF-300RTest method
      AppearanceLight yellow and transparent liquidVisual examination
      Color number8Gardener method
      Specific gravity0.818JIS Z 3197(1986)
      Viscosity (mPa.s)4.3JIS Z 3197(1986)
      Solid content(%)12100℃,1h
      Chlorine content(%)0.08JIS Z 3197(1986)
      Spreading factor(%)92JIS Z 3197(1986)
      Copper plate corrosionPassingJIS Z 3197(1986)
      Water extract resistivity  (Ω･cm)1×1011JIS Z 3197(1986)


    Legal declaration  |  Sitemap  |  Visiting route

    Follow us:

    Micro-scan sweep

    Copyright © 1999-2017 Hapoin Enterprise 沪 ICP 备 11051220 号 沪公网安备 31010502002237号All Rights Reservedbottom.png