ULF-210RH Features:

· Foam application can be used even if the solid content is lower

· For automatic soldering machine,carrier pawl for printed circuit boards is not almost contaminated

· Flux residue after soldering is light-colored,and remains very little

· Free of troubles,such as checker pins,etc.because of very little flux residue

· Excellent solderability though low solid content because of almost free of bridges between QFPs or chips and of non-wetting of circuit lands

· Excellent flux film reliability because of good compatibility of resin with active ingredient

ULF-210RH Parameter:

• TAMURAULF-500VS
  
  ULF-500VS is a low residue, mat type post-flux developed for automatic soldering of printed circuit boards mounted with chip parts and discreet parts.
• TAMURAULF-210R
  
  ULF-210R is a light-colored, highly heat-resistant, special synthetic resin type ultralow residue flux developed for automated soldering of printed wiring boards mounted with chips general discrets.
• TAMURAULF-300R
  
  ULF-300R is a ultra low residue type post-flux developed for automatic soldering of printed circuit boards mounted with chip parts and discreet parts. The flux have little flux residue．Furthermore, the flux residue is excellent in reliability so that it is most appropriate for soldering aim at non-washing of flux.