RM-26-15 Features:

· Excellent in reliability

· As the flux residue is not corrosive and is excellent in electrical insulation, it does not require to clean off the flux residue for usual printed circuit boards

· Excellent soldering workability for automatic soldering process

· This flux is suitable for soldering of the highly integrated printed circuit boards，as it causes hardly the soldering failure such as icicle, bridge and/or non-wetting of solder that require correction, after soldering.

· It also ensures high suitability for the printed circuit boards with chip components

· Its flux reside is easily dissolved by organic solvents of various types and this can remove it easily by cleaning as necessary

RM-26-15 Parameter:

• TAMURAULF-210RH
  
  ULF-210RH is a special synthetic resin based,foam application type ultra-low-residue flux which is light-colored and excellent in heat resistance,developed for the automatic soldering of printed wiring boards mounted with chip parts and general discrete parts
• TAMURALCF-030
  
  Tamura LCF-030 Flux
• TAMURAEXKW-007
  
  EXKW-007 is a water-soluble type flux, developed for the soldering of lead wire and case in electronic parts.
• TAMURAEC-25
  
  Post-flux for printed circuit boards mounted with chip parts for Pb-free soldering
• TAMURAEC-19S-A
  
  EC-19S-A Low-residue type Post-flux for printed circuit boards mounted with chip parts for Pb-free soldering.
• TAMURAEC-19S-10
  
  EC-19S-10 is a high performance,mat type flux developed for automatic soldering using Pb-free solders and an excellent solderability can be obtained with it in Pb-free soldering.