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    EC-25 Features:

    · An excellent solderability can be obtained in Sn/Ag/Cu, Sn/Ag/Cu/Bi and Sn/Cu based Pb-free solder

    · The product will solve troubles in soldering such as non-wetting and bridge defect in the soldering of printed circuit boards mounted with chip parts and discreet parts

    · Excellent in PTH flow up

    · Excellent to form mat soldered-surface

    · The residual flux is non-corrosive and excellent in electric insulation

    · Uniform flux coating can be achieved by foaming or spraying

    EC-25 Parameter:

    ItemsEC-25Test method
    AppearanceLight yellow transparent LiquidVisual examination
    Color number2 or lessGardener method
    Specific gravity0.826JIS Z 3197(1986)
    Viscosity (mPa・s)340JIS Z 3197(1986)
    Solid content (%)15100℃, 1h
    Chlorine content (%)7JIS Z 3197(1986)
    Solder spread(%)Sn/Pb3790JIS Z 3197(1999)
    Copper plate corrosionPassingJIS Z 3197(1999)
    Water extract resistivity  (Ω・cm)
    More than 1×1010JIS Z 3197 (1999) 40℃, 90%R.H.
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