EC-25 Features:

· An excellent solderability can be obtained in Sn/Ag/Cu, Sn/Ag/Cu/Bi and Sn/Cu based Pb-free solder

· The product will solve troubles in soldering such as non-wetting and bridge defect in the soldering of printed circuit boards mounted with chip parts and discreet parts

· Excellent in PTH flow up

· Excellent to form mat soldered-surface

· The residual flux is non-corrosive and excellent in electric insulation

· Uniform flux coating can be achieved by foaming or spraying

EC-25 Parameter:

• TAMURAEC-19S-8
  
  Post-flux for printed circuit boards mounted with chip parts for Pb-free soldering.
• TAMURAEXKW-007
  
  EXKW-007 is a water-soluble type flux, developed for the soldering of lead wire and case in electronic parts.
• TAMURAEC-19S-A
  
  EC-19S-A Low-residue type Post-flux for printed circuit boards mounted with chip parts for Pb-free soldering.
• TAMURAEC-19S-10
  
  EC-19S-10 is a high performance,mat type flux developed for automatic soldering using Pb-free solders and an excellent solderability can be obtained with it in Pb-free soldering.
• TAMURAEC-15-7
  
  EC-15-7 is a high performance, low-residue type flux developed for automatic soldering using Pb-free solders and an excellent solderability can be obtained with it in Pb-free soldering.
• TAMURACF-030AGM-3
  
  CF-030AGM-3 is a high performance,mat type flux developed for automatic soldering using low silver Pb-free solders and an excellent solderability can be obtained with it in Pb-free soldering.