TAMURA EC-19S-A Flux HAPOIN

Established in November 1999，we are committed to introducing high technology equipments, precision instruments, advanced production materials in order to improve the product quality at the domestic electronic manufacturing industries.

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Established in November 1999，we are committed to introducing high technology equipments, precision instruments, advanced production materials in order to improve the product quality at the domestic electronic manufacturing industries.
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Established in November 1999，we are committed to introducing high technology equipments, precision instruments, advanced production materials in order to improve the product quality at the domestic electronic manufacturing industries.
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Established in November 1999，we are committed to introducing high technology equipments, precision instruments, advanced production materials in order to improve the product quality at the domestic electronic manufacturing industries.
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Established in November 1999，we are committed to introducing high technology equipments, precision instruments, advanced production materials in order to improve the product quality at the domestic electronic manufacturing industries.

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TAMURA EC-19S-AFlux

Summary
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Application
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EC-19S-A Features:

· An excellent solderability can be obtained in Sn/Ag/Cu, Sn/Ag/Cu/Bi and Sn/Cu based Pb-free solder

· The product will solve troubles in soldering such as non-wetting and bridge defect in the soldering of printed circuit boards mounted with chip parts and discreet parts

· Excellent in PTH flow up

· Very little, tack-free and light-colored flux residue after soldering

· Excellent to form mat soldered-surface

· The residual flux is non-corrosive and excellent in electric insulation

· Uniform flux coating can be achieved by foaming or spraying

EC-19S-A Parameter:

Items		EC-19S-A	Test method
Appearance		Light yellow transparent Liquid	Visual examination
Color number		2	JIS Z 3197(1999)
Specific gravity		0.803	JIS Z 3197(1999)
Viscosity (mPa･s)		3.7	JIS Z 3197(1999)
Flash point (℃)		11.7	JIS K 2539 (tag closed cup)
Solid content (%)		7	JIS Z 3197(1999)
Chlorine content (%)		0.04	JIS Z 3197(1999)
Acid value		15	JIS Z 3197(1999)
Solder spread(%)	Sn/Ag3.0/Cu0.5	75	JIS Z 3197(1999)
	Sn/Cu0.7	75
	Sn/Pb37	89
Copper plate corrosion		Passing	JIS Z 3197(1999)
Water extract resistivity (Ω･cm)		4×10⁴	JIS Z 3197(1999)