TAMURA EC-19S-AFlux
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    EC-19S-A Features:

    · An excellent solderability can be obtained in Sn/Ag/Cu, Sn/Ag/Cu/Bi and Sn/Cu based Pb-free solder

    · The product will solve troubles in soldering such as non-wetting and bridge defect in the soldering of printed circuit boards mounted with chip parts and discreet parts

    · Excellent in PTH flow up

    · Very little, tack-free and light-colored flux residue after soldering

    · Excellent to form mat soldered-surface

    · The residual flux is non-corrosive and excellent in electric insulation

    · Uniform flux coating can be achieved by foaming or spraying

    EC-19S-A Parameter:

    ItemsEC-19S-ATest method
    AppearanceLight yellow transparent LiquidVisual examination
    Color number2JIS Z 3197(1999)
    Specific gravity0.803JIS Z 3197(1999)
    Viscosity (mPa・s)3.7JIS Z 3197(1999)
    Flash point (℃)11.7JIS K 2539 (tag closed cup)
    Solid content (%)7JIS Z 3197(1999)
    Chlorine content (%)0.04JIS Z 3197(1999)
    Acid value15JIS Z 3197(1999)
    Solder spread(%)Sn/Ag3.0/Cu0.575JIS Z 3197(1999)
    Sn/Cu0.775
    Sn/Pb3789
    Copper plate corrosionPassingJIS Z 3197(1999)
    Water extract resistivity  (Ω・cm)
    4×104JIS Z 3197(1999)
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