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    EC-19S-8 Features:

    · An excellent solderability can be obtained in Sn/Ag/Cu, Sn/Ag/Cu/Bi and Sn/Cu based Pb-free solder

    · The product will solve troubles in soldering such as non-wetting and bridge defect in the soldering of printed circuit boards mounted with chip parts and discreet parts

    · Since the flux is of mat type and the surface of solder after soldering will present uniform matted conditions, the inspection after soldering will be easy

    · The residual flux is non-corrosive and excellent in electric insulation

    · Uniform flux coating can be achieved by foaming or spraying

    EC-19S-8 Parameter:

    ItemsEC-19S-8 Test method
    AppearanceLight yellow transparent LiquidVisual examination
    Color number3Gardener method
    Specific gravity0.822JIS Z 3197(1986)
    Viscosity (mPa・s)3.9JIS Z 3197(1986)
    Flash point(℃)11.7JIS K 2539(tag closed cup)
    Solid content (%)15100℃,1h
    Chlorine content (%)0.08JIS Z 3197(1986)
    Acid value30JIS Z 3197(1986)
    Solder spread(%)Sn/Ag3.0/Cu0.579JIS Z 3197(1986)
    Copper plate corrosionPassingJIS Z 3197(1986)
    Water extract resistivity  (Ω・cm)1.0×104JIS Z 3197(1986)

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