EC-19S-8 Features:

· An excellent solderability can be obtained in Sn/Ag/Cu, Sn/Ag/Cu/Bi and Sn/Cu based Pb-free solder

· The product will solve troubles in soldering such as non-wetting and bridge defect in the soldering of printed circuit boards mounted with chip parts and discreet parts

· Since the flux is of mat type and the surface of solder after soldering will present uniform matted conditions, the inspection after soldering will be easy

· The residual flux is non-corrosive and excellent in electric insulation

· Uniform flux coating can be achieved by foaming or spraying

EC-19S-8 Parameter:

• TAMURAULF-300R
  
  ULF-300R is a ultra low residue type post-flux developed for automatic soldering of printed circuit boards mounted with chip parts and discreet parts. The flux have little flux residue．Furthermore, the flux residue is excellent in reliability so that it is most appropriate for soldering aim at non-washing of flux.
• TAMURANHF-01
  
  Tamura NHF-01 Flux
• TAMURAULF-37
  
  TAMURA ULF-37 Flux