EC-19S-10 Features:
· An excellent solderability can be obtained in Sn/Ag/Cu, Sn/Ag/Cu/Bi and Sn/Cu based Pb-free solder
· The residual flux is non-corrosive and the finish is free from stickiness, and excellent in electric insulation
· The product will solve troubles in soldering such as non-wetting and bridge defect in the soldering of printed circuit boards mounted with chip parts and discreet parts
· Excellent in PTH flow up
· Since the flux is mat type and the surface of solder after soldering will present uniform matted conditions, the inspection after soldering will be easy
· Uniform flux coating can be achieved by foaming or spraying