TAMURA EC-15-7Flux
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    EC-15-7 Features:

    · An excellent solderability can be obtained in Sn/Ag/Cu, Sn/Ag/Cu/Bi and Sn/Cu based Pb-free solder

    · The product will solve troubles in soldering such as non-wetting and bridge defect in the soldering of printed circuit boards mounted with chip parts and discreet parts

    · With little flux residue, the color tone is achromatic and the finish is free from stickiness

    · The residual flux is non-corrosive and excellent in electric insulation

    · Uniform flux coating can be achieved by foaming or spraying


    EC-15-7 Parameter:

    ItemsEC-15-7Test method
    AppearanceLight yellow transparent LiquidVisual examination
    Color number2JIS Z 3197(1999)
    Specific gravity0.810JIS Z 3197(1999)
    Viscosity (mPa・s)3.9JIS Z 3197(1999)
    Solid content (%)6JIS Z 3197(1999)
    Chlorine content (%)0.02JIS Z 3197(1999)
    Solder spread(%)Sn/Pb3789JIS Z 3197(1999)
    Sn/Ag3.0/Cu0.577
    Sn/Ag2.5/Cu0.5/Bi1.076
    Sn/ Cu0.773
    Copper plate corrosionPassingJIS Z 3197(1999)
    Water extract resistivity  (Ω・cm)2×109JIS Z 3197(1999)


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