TAMURA CF-030AGM-3 Flux HAPOIN

Established in November 1999，we are committed to introducing high technology equipments, precision instruments, advanced production materials in order to improve the product quality at the domestic electronic manufacturing industries.

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Established in November 1999，we are committed to introducing high technology equipments, precision instruments, advanced production materials in order to improve the product quality at the domestic electronic manufacturing industries.
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Established in November 1999，we are committed to introducing high technology equipments, precision instruments, advanced production materials in order to improve the product quality at the domestic electronic manufacturing industries.
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Established in November 1999，we are committed to introducing high technology equipments, precision instruments, advanced production materials in order to improve the product quality at the domestic electronic manufacturing industries.
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Established in November 1999，we are committed to introducing high technology equipments, precision instruments, advanced production materials in order to improve the product quality at the domestic electronic manufacturing industries.

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TAMURA CF-030AGM-3Flux

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CF-030AGM-3 Features:

· An excellent solderability can be obtained in low silver based Pb-free solder

· The product will solve troubles in soldering such as non- wetting and bridge defect in the soldering of printed circuit boards mounted with chip parts and discreet parts

· Since the flux is of mat type and the surface of solder after soldering will present uniform matted conditions, the inspection after soldering will be easy

· The residual flux is non-corrosive and excellent in electric insulation

· Uniform flux coating can be achieved by foaming or spraying

CF-030AGM-3 Parameter:

Items		CF-030AGM-3	Test method
Appearance		Light yellow transparent Liquid	Visual examination
Color number		3	JIS Z 3197(1999)
Specific gravity		0.822	JIS Z 3197(1999)
Viscosity (mPa･s)		4.7	JIS Z 3197(1999)
Solid content (%)		15	JIS Z 3197(1999)
Chlorine content (%)		0.08	JIS Z 3197(1999)
Acid value		36	JIS Z 3197(1999)
Solder spread(%)	Sn/Ag3.0/Cu0.5	78	JIS Z 3197(1999)
	Sn/Ag0.3/Cu0.7	77
	Sn/Pb37	92
Copper plate corrosion		Passing	JIS Z 3197(1999)
Water extract resistivity (Ω･cm)		3×10⁴	JIS Z 3197(1999)