DIC  RD-500SV  BGA Rework Machines for Stable and Safe 

 Using the RD-500SV’s Underfill Mode, everything from the heating to the position of the head parts is adjusted automatically. Therefore the device performs every operation automatically, except the removal of parts.

Feature

・Managing and Editing Your Profiles Easily

・3-Point Auto – Profiling

・One click advanced settings are supported in Easy Selection mode

・Wide support to industrial large-scale and small-scale circuit boards, including 01005 components

・A strong support for the rework of < 01005 devices

・High Performance 3 Point Heating System

・From large to small-scale a versatile circuit board holder

・Easy Operating, CPS - Component Print Station, and AFD - Auto Flux Dipping

• DICRD-500III
  
  BGA Rework Machines RD-500III,designed for Standard or Lead Free Solders, Large or Small Boards, Large or Small Components
• DICRD-500SIII
  
  RD-500SIII BGA Rework Machines,designed for Standard or Lead Free Solders, Large or Small Boards, Large or Small Components