DIC RD-500SV BGA Rework Machines for Stable and Safe
Using the RD-500SV’s Underfill Mode, everything from the heating to the position of the head parts is adjusted automatically. Therefore the device performs every operation automatically, except the removal of parts.
Feature
・Managing and Editing Your Profiles Easily
・3-Point Auto – Profiling
・One click advanced settings are supported in Easy Selection mode
・Wide support to industrial large-scale and small-scale circuit boards, including 01005 components
・A strong support for the rework of < 01005 devices
・High Performance 3 Point Heating System
・From large to small-scale a versatile circuit board holder
・Easy Operating, CPS - Component Print Station, and AFD - Auto Flux Dipping