DIC RD-500SIIIBGA Rework Machines
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    DIC  RD-500SIII  BGA Rework Machines for Stable and Safe Rework

    Designed for Standard or Lead Free Solders, Large or Small Boards, Large or Small Components



    ■ Trouble Free Internal Flash Memory Hard Drive

    ■ 3 Separate Heaters for Lead Free Solder

    ■ Long Wave IR Area Heater to Prevent PCB Warping

    ■ 2 Mode Cooling Functions

    ■ Security Lock-out Function

    ■ 2 Point Component Control Auto-profiling

    ■ Convenient Inspection Function

    ■ 5 Thermocouple Inputs

    ■ Fully Integrated from Solder Cream Application to

     Component Placement

    ■ Semi-automatic System

    ■ Useful for a Wide Variety of Rework

    Maximum PCB   Size

    400mm X 420mm

    Device Size   Range

    2mm -50mm

    Placement   Accuracy

    +/- 0.025mm

    Top Hot Air   Heater

    700Watt Hot   Air

    Bottom Hot Air   Heater

    700Watt Hot   Air

    Area Heater

    400W X 3(IR)   1200Watt Total 

    Temperature   Setting Range Top & Bottom Hot Air Heater

    0 - 650 °C

    Temperature   Setting Range Area Heater

    0 - 650 °C

    PC Operating   System

    Controller (PC-500)

    Monitor Size

    17 Inch LCD   Display

    Overall Size

    580W X 580D X   735H (Without foot)

    Overall Weight

    Approximately   50kg

    Air   Requirements

    80L/min (0.2 -   1.0MPa)

    Electrical   Requirements

    AC200-230V   2.6kW(1.4kW for Main Body, 1200W for Area Heater)

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