SAM30-401-11 Features:
· Pb-free (Sn /58 Bi) solder alloy is used
· This paste is VOC free
· Available to form a physical joint with low load pressure(<2.0 MPa)
· Available for narrow pitch connection
· It is possible to reduce the dead space
· Available to form a connection on Cu-OSP not only Au land
· It is the repairable material