TAMURA SAM30-401-11Advanced Super
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    SAM30-401-11 Features:

    · Pb-free (Sn /58 Bi) solder alloy is used

    · This paste is VOC free

    · Available to form a physical joint with  low load pressure(<2.0 MPa)

    · Available for narrow pitch connection

    · It is possible to reduce the dead space

    · Available to form a connection on Cu-OSP not only Au land

    · It is the repairable material

    SAM30-401-11 Parameter:

    ItemsSAM30-401-11Test methods
    Alloy compositionSn / 58BiJIS Z 3282 (1999)
    Melting point139 ℃According to DSC measurement
    Particle size of solder powder1~12 μmAccording to laser diffraction method
    Shape of solder powderSphericalAnnex 1 to JIS Z 3284 (1994)
    Flux content62.50%

    Viscosity125 Pa・sAnnex 6 to JIS Z 3284 (1994)
    Viscometer, type PCU, manufactured by Malcom, at 25℃
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