SAM30-401-11 Features:

· Pb-free (Sn /58 Bi) solder alloy is used

· This paste is VOC free

· Available to form a physical joint with  low load pressure(＜2.0 MPa)

· Available for narrow pitch connection

· It is possible to reduce the dead space

· Available to form a connection on Cu-OSP not only Au land

· It is the repairable material

SAM30-401-11 Parameter:

• TAMURASAM10-401-27
  
  Advanced Super Cunductor SAM10-401-27 is a Conductive Adhesive which is composed of a Sn/Bi low-melting point Pb-free solder and an epoxy-based thermosetting resin. Low temperture soldering which are approximatly 160℃ achieve adequate solder joints and high shear strengths by an adhesive property of thermosetting resin at once. The covered films have high reliability without cleaning.
• TAMURAGAW33-36ST
  
  Spray fluxer is built into equipment with special low-pressure nozzle.
• TAMURASAM30-401-11
  
  Advanced Super Conductor SAM30-401-11 is Thermosetting Conductive Adhesive Pasete used Sn/Bi type Pb free low meltingpoint solder powder and thermosetting resin for M/M-ESC Process. M/M-ESC Process is joint method with low load pressure and temperature between module substrates. An electric and a high joint strength are formed together by heating and pressing. This material has advantages on the reduction of process and dead space, load pressure, Cu-OSP connection and repairabling compare to the current ACF method.