SAM10-401-27 Features:

· Proper soldering and curing with the adhesive can be achieved by using low temperatute.(160℃-4min)

· Sn/Bi, Pb-free solder alloy is used

· This product is VOC free and Halogen free paste.

· The cured films have high insulation resistance values and no need to be cleaned

· Cured films keep the high shear strength after 85℃/85% storage so they have high reliability

· During continuous printing the viscosity is stable. And the stencil life is longer

SAM10-401-27 Parameter:

• TAMURASAM30-401-11
  
  Advanced Super Conductor SAM30-401-11 is Thermosetting Conductive Adhesive Pasete used Sn/Bi type Pb free low meltingpoint solder powder and thermosetting resin for M/M-ESC Process. M/M-ESC Process is joint method with low load pressure and temperature between module substrates. An electric and a high joint strength are formed together by heating and pressing. This material has advantages on the reduction of process and dead space, load pressure, Cu-OSP connection and repairabling compare to the current ACF method.
• TAMURASAM10-401-27
  
  Advanced Super Cunductor SAM10-401-27 is a Conductive Adhesive which is composed of a Sn/Bi low-melting point Pb-free solder and an epoxy-based thermosetting resin. Low temperture soldering which are approximatly 160℃ achieve adequate solder joints and high shear strengths by an adhesive property of thermosetting resin at once. The covered films have high reliability without cleaning.
• TAMURATC-131L-1
  
  TC-131L-1 is coating agent developed to prevent the flux from penetraing to the rear side of printed circuit boards in the soldering process.