ADT 8030 Dicing system has two facing spindles that can simultaneously dice wafers at high throughput.  ADT 8030 is a high accuracy system that can dice products up to 12” in diameter or 12” × 12” product,  at high performances and low cost of operation.

• ADT8020 Series
  
  ADT 8020 Dicing Saw has two facing spindles that can simultaneously dice wafers at high throughput. ADT 8020 is a high accuracy system that can dice product up to 8-inch in diameter, at high performances and low cost of operation.
• ADT7120/7130 Series
  
  The 7120/7130 family of 2” and 4” spindle dicing systems deliver a high level of affordability and flexibility.
• ADT7220 Series
  
  The 7220 series offers a wide range of advanced automation and process monitoring options to meet the throughput and quality requirements of your most challenging dicing applications: Silicon, Glass on Silicon, Glass, BGA & QFN packages, LTCC, Ceramic, PCB and other hard material applications.