ADT 8030 SeriesFULLY AUTOMATIC 12" TWIN Dicing system
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    8030 Series Dicing system:

    ADT 8030 Dicing system has two facing spindles that can simultaneously dice wafers at high throughput.  ADT 8030 is a high accuracy system that can dice products up to 12” in diameter or 12” × 12” product,  at high performances and low cost of operation.

    8030 Series Dicing system FEATURE & BENEFITS

    Bridge type frame

    Flexibility - Supports Hub and Hubless blades up to 3”O.D.

    Dual microscopes, fixed non-contact sensors and two dress stations

    Spindles of 1.8 KW or 2.2 KW high power (for challenging applications)

    Superior vision system with continuous zoom magnification

    Intuitive operation interface using a large 19” touch screen monitor


    Highest dicing process speeds - Lowest cost

    Support up to 12”× 12” square products

    Industrial PC based on Win 10 OS

    Air bearing feed axis (X)

    Fast & Simple blade change with a spindle shaft lock mechanism

    Fast automatic alignment and cut positioning for increased throughput

    Automatic Kerf inspection and quality analysis for maximum precision

    Process data logging and statistical analysis

    SECS / GEM platform ready

    Load port ready for factory automation

    All electronic on top of the cut chamber

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